Random Site Quote: As the leading foundry group for analog/mixed-signal semiconductor applications, X-FAB offers modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.18 µm, and special BCD, SOI and MEMS long-lifetime processes.
As the world's leading foundry group for analog/mixed-signal semiconductor applications, X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of

Random Site Quote: SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible advanced CMOS logic, mixed-signal and RF process technologies in 0.25-micron, 0.22-micron, 0.18-micron , 0.16-micron and 0.13-micron feature sizes . In addition, Silterra offers leading edge high density, high voltage technologies. SilTerra’s wafer fab has a designed capacity of 40,000 200mm wafers per month. Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support.
© 2007 Silterra Malaysia Sdn. Bhd. All Rights Reserved. Multi Project Wafer (MPW) program is a cost-effective, multi-project designs and IP verification service for Customers and IP providers. This program is run regularly and multiple customers can join the MPW program by sharing the mask Our

Random Site Quote: wafer foundry, discrete semiconductors, integrated circuits, integrated passive components, BARE DIE ASSEMBLIES, GREEN PACKAGES, LAMINATE CHIP SCALE PACKAGES, MULTI CHIP MODULE PACKAGES CHIP SCALE PACKAGES, INTEGRATED PASSIVE DEVICES ON SILICON PCB, LEAD LESS CHIP SCALE PACKAGES, SYSTEM IN PACKAGE -SIP, CHIP ON BOARD, KNOWN GOOD DIE, LEAD FREE PACKAGES, SILICON SYSTEM IN PACKAGE, FLIP CHIP KNOWN GOOD BARE DIE, MOLDED LEAD FRAME PACKAGES, SILICON PRINTED CIRCUIT BOARD
SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It

Random Site Quote: As the leading foundry group for analog/mixed-signal semiconductor applications, X-FAB offers modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.18 µm, and special BCD, SOI and MEMS long-lifetime processes.
As the world's leading foundry group for analog/mixed-signal semiconductor applications, X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of