http://www.robotherm.comManufactures infrared and ultraviolet ovens and driers for film processing of semiconductors, smart cards, and IC packaging. France. Site in English and French.Caléo Engineering is an Automation and Equipment Manufacturing Company specialized in the field of Electronic Assembly, Semiconductors Packaging, Smart Cards, C.O.B (Chip-on-Board), C.O.F (Chip-on-Flex), S.M.T (Surface Mounted Technology) and Hybrids Industries. Our Company was first established to manufacture Controlled Atmosphere and In-line Infrared Ovens. Subsequently, the Company developed Positioning and Indexing Systems for Semiconductors Assembling and Packaging Equipment.Then, the Smart Card Technology opened up new perspectives, which lead us to develop solutions adapted to High-standard Applications, opening the way for a wide range of Customized Automates & Equipments dedicated to the Micro-electronic Market. Today Caléo Engineering offers :¦ Standard Products for Semiconductors, Smart Cards, C.O.B, C.O.F, S.M.T and Hybrids Applications¦ Customized Sub-Systems for the micro electronic assembly applications¦ Upgrades & Retrofits for Standard OEM Equipment ¦ Integration & Turnkey solutions
A vibration free solution to
movement restriction on wire bonders.
Our assignment was to carry out bumping on 125 mm diameter silicon
wafers, while the machine's capacity for movement did not enable the
whole surface to be covered
The solution we selected enabled the part to be processed to be
waiting for hand_moderationTools and Equipment > Product Handling
High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull and stud pull. Pick and place machines for silicon, GaAs and InP die for silicon and laser diode manufacturers.