High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull and stud pull. Pick and place machines for silicon, GaAs and InP die for silicon and laser diode manufacturers.
Manufactures automated die sorting equipment for packaging semiconductor wafers and surface mount (SMT) components. Site has equipment photos general descriptions.
Develops equipment for semiconductor processes, including small process furnaces, reflow solder ovens, annealing and baking systems, hot plates, and wire bond tools. Product photos and data sheets.