Valley Design Corp.

Url http://www.valleydesign.com Description Offers thinning silicon, GaAs, InP, InSb, GaSb, GaP or any other semiconductor or insulating material wafers or dice. East and West coast, USA, facilities. Random Quote Polishing, lapping, back-lapping, dicing, backgrinding are some of the capabilities of the world's leading company supplying optical polishing services.
Lapping and Optical Polishing of Flat, Thin, Precise Parts Optical polishing, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing, backgrinding, flat lapping and machining of all hard materials including Ceramic substrates, Quartz, Aluminum Nitride Category Contract Manufacturing > Wafers Keywords optical polishing lapping polishing dicing lapping substrates ceramics dicing polished substrates ceramics thinning CMP CMP polishing

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