http://www.suss.com/Manufacturer of mask aligners, bonders, flip chip bonders, spin coaters and probe systems for the mems, advanced packaging for the semiconductor markets.SUSS MicroTec listed in Deutsche Borse AG's Prime Standard is one of the worldâs leading suppliers of process and testing solutions for markets such as MEMS, compound semiconductor and 3D Interconnect
Designs, engineers and manufactures massively parallel test systems, burn-in systems, die carriers, test fixtures and related accessories used in the semiconductor industry. (Nasdaq: AEHR).
Manufacturer of mask aligners, bonders, flip chip bonders, spin coaters and probe systems for the mems, advanced packaging for the semiconductor markets.
Manufactures point-of-use environmental equipment, thin film materials and delivery systems, and thin film deposition services to the semiconductor industry. (Nasdaq: ATMI)
Manufacturer of metallization and interconnect, electrochemical deposition (ECD), wet cleaning and etching, thermal diffusion, and auxiliary equipment for semiconductor manufacturing processes.