http://www.rdautomation.comManufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.Laurier Inc. of Londonderry, NH has built the largest installed base of semi-automatic and fully automated die sorting systems in the world. Laurier also manufactures high precision flip chip die bonders and stacked tray feeders for automated handling of Waffle packs and JEDEC trays.
Laurier is a manufacturer of back-end microelectronic assembly equipment. Located in the north east region of the United States, Laurier integrates leading edge technologies and processes, into innovative assembly solutions for the semiconductor and related industries. As part of the Besi family,Tools and EquipmentLaurierLaurierInc.ManchesterNew Hampshiredie sortingdie sortdie platingdie pick and placetape and reeldie to tape reel
Providers of microwave plasma tools for ashing, resist strip, descum, polyimide and paralyne removal, surface cleaning and isotropic etch processing for semiconductor wafers, flat panel displays , mems and optoelectronics.