http://www.asekr.comAssembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.waiting for hand_moderationContract ManufacturingASEKorea
Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Include capabilities, and illustrated discussions of packaging technologies and processes.
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.