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Procuring and processing semiconductor components in wafer, die and packaged form.
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Eltek offers component obsolescence management, Silicon Procurement - Wafer Probe - Sawing and Offload Semiconductor Die & KGD into Waffle Pack - Gel-Pak and Surftape Tape & Reel -Component Obsolescence by Die Banking - Custom Assembly - Component
High quality semiconductor die for hybrid and chip on board applications.
Wafer Sub-Contract Processing
Automated wafer probe, saw and die sort. Bare die tape and reel service.
Packaging & Screening Services
Cost effective packaging service for industry-standard and custom configurations.
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Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
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Spectrum Microwave Marlborough Division, located in Marlborough, MA is the center of excellence with in the corporation for microelectronics design and manufacturing. Our 30,000 sq ft manufacturing operation is an ISO 9001 Registered facility fully certified to MIL-PRF-38534 Class H and Class K
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Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
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Dolphin Technology, Inc. provides a
wide range of High Performance, High Speed, Low-Power Silicon IP (SIP).
For designers who need standard or custom IP such as memory, I/O,
standard cell libraries, data path modules or analog blocks. Dolphin
Technology delivers quality, high performance, high
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Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
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First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.
First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design,
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Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
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Welcome to Catalyst Microtech LLC
Catalyst Microtech specializes in quick-turn prototype packaging and advanced assembly services for the semiconductor industry. Our quick turn services, and the wide range of technologies we support, provide our customers with a reliable assembly source.
When it
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Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
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subsidiary of United Pacific Industries Limited - HKSE:176)
Jade Precision Engineering Pte Ltd
Precision Engineering Pte Ltd ("JPE"), incorporated in Singapore,is a wholly
owned subsidiary of United Pacific Industries Limited which is listed in the
Stock Exchange of Hong Kong (Stock Code: 176).
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Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
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SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible advanced CMOS logic, mixed-signal and RF process technologies in 0.25-micron, 0.22-micron, 0.18-micron , 0.16-micron and 0.13-micron feature sizes . In addition, Silterra offers leading edge high density, high voltage technologies. SilTerra’s wafer fab has a designed capacity of 40,000 200mm wafers per month. Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support.
© 2007 Silterra Malaysia Sdn. Bhd. All Rights Reserved.
Multi Project Wafer (MPW) program is a
cost-effective, multi-project designs and IP
verification service for Customers and IP providers.
This program is run regularly and multiple customers
can join the MPW program by sharing the mask
Our
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Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
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Promex Industries Home Page
Silicon Valley’s Packaging Foundry
IC Assembly
Custom Packaging Foundry
High Tech Onshore SMT
· IC Assembly Services: Quick Turns &
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Offers turnkey contract manufacturing, logistics and testing services.
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With corporate headquarters in Austin, Texas, the ACI Group of companies employs more than 300 professionals nationwide and operates multiple, strategically positioned facilities in North America. Along with affiliates in Latin America our subsidiaries provide real world solutions covering a broad
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Provides semiconductor IC assembly and testing services.
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Sigurd is a leading independent provider of semiconductor
assembly and test services in Taiwan. By leveraging the
state-of-the-art IC assembly and test equipment and
technologies, we offer a fully integrated suite of
semiconductor backend manufacturing services to our
We own several hundred
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