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Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
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WaferTech is the largest semiconductor integrated circuit foundry in the United States--a world class provider ICs
Limited Liability Company
Copyright© WaferTech Limited Liability Company 2002-2008, All
Whether you are a seasoned professional, or just starting your
career, we offer a strong focus of making sure that you are not just an employee, but a valued member of the team.
If you have an interest in
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Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
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Aviza Technology, Inc. (NASDAQ GM: AVZA) designs, manufactures, sells and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets.
SCOTTS VALLEY, CA, June 12, 2009
SCOTTS VALLEY, CA, June 10, 2009
SCOTTS VALLEY, CA, May 19, 2009
SCOTTS VALLEY, CA, Apr 28, 2009
SCOTTS VALLEY, CA, Feb 3, 2009
SCOTTS VALLEY, CA, Jan 7, 2009
(NASDAQ GM: AVZA) designs, manufactures, sells
and supports advanced semiconductor capital
equipment
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An independent subcontractor for semiconductor assembly, test and packaging services.
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waiting for hand_moderation
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Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
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Located in Bloomington, Minnesota, Polar Semiconductor is a wholly owned subsidiary of Sanken Electric Company, Ltd. We operate a 200,000 square-foot facility that includes 62,000 square feet of cleanroom space for wafer fabrication. Our manufacturing facilities consist of a six-inch (150mm) and an
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European supplier of advanced semiconductor burn-in and reliability test systems.
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Leading Provider Of Burn-In Test Equipment & Services
INDEPENDENT TEST LABORATORY
Optical & Laser Components
Since 2002, Reltech Limited has provided comprehensive semiconductor testing services, Burn-In, Reliability & Life Testing and Qualification for many well-known manufacturers
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Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
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PREMIER Semiconductor Services
Value-add Solutions in Final Manufacturing and Test
Premier Semiconductor Services ( PremierS2 ) provides outsourced value-add final
manufacturing and test services, including IC Counterfeit Detection and the Pb Free
Conversion for BGA's and other package types.
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Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom.
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SBG or SBE Gateway
Helps meet growing demand for effective solutions to manage heat produ...
Creating solutions for flexible displays, OLEDs and photovoltaics for...
New state-of-the-art equipment to further leading thermal management
Solutions to the industry's critical thermal management challenges
We provide a
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Offers custom layout and fabrication services for emerging companies and university groups.
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holders and stages for electron microscopes that enable in situ analysis with atomic resolution .
Manufactured without plastics and free from organic residues,
is the premier holey carbon film for cryo-transmission electron microscopy.
is the market leading specimen support in materials science
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Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
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Semiconductor & MEMS Foundry
DALSA Semiconductor As a pure-play foundry, our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies to help them succeed with their advanced MEMS or IC designs.
Featured Content New MEMS Brochure
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Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
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Amitec provides HDI substrates and flip chip Ball Grid Array (FCBGA) for advanced packaging applications
Flip Chip Ball Grid Array Substrates
AMITEC provides high performance chip
carriers and Flip Chip Ball Grid Array
(FCBGA) substrates for advanced packaging
We offer total technology solutions by
designing, manufacturing, testing and
assembling our thin film based substrates.
Copyright©
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